XC7Z010, SoC PCB design with FPGA IC

The board features the design of the Xilinx (now AMD) Zynq-7000 series XC7Z010 SoC chip in a FBGA package. The sketch shows a high-density BGA package, DDR3 memory interface, power/ground connections, and signal routing. The Zynq-7000 is an SoC that integrates ARM Cortex-A9 processor cores with FPGA programmable logic. XC7Z010 Features: 28nm technology, 28k logic cell DDR3 support, integrated Ethernet, USB, and GPIOs. Power consumption is low (typical 2-5W, depending on usage).

Applications: Optimized for industrial IoT, embedded vision, and motor control. Those familiar with FBGA design and coding will know that it's very challenging, and the application areas are generally industrial solutions.

Role in Zynq-7000: The symmetrical BGA distribution between the ARM and FPGA, as seen in the diagram, is critical for signal integrity, as is the difficulty of fan-out routing and impedance calculations. Because the circuit is designed entirely for IP-controlled signal processing, high-frequency components were selected appropriately.

For high-speed DDR3 (SI), SSTL-15 standard (Zynq I/O), RZQ/6 Address lines with ODT (On-Die Termination) serial 48 - 52Ω terminations, differential clocks 100Ω.or high-speed DDR3 (SI), SSTL-15 standard (Zynq I/O), RZQ/6 Address lines with ODT (On-Die Termination) serial 48 - 52Ω terminations,or high-speed DDR3 (SI), SSTL-15 standard (Zynq I/O), RZQ/6 Address lines with ODT (On-Die Termination) serial 48 - 52Ω terminations, differential clocks 100Ω. Decoupling distance >3x width (compatible in drawing) to avoid crosstalk. PCB Design: (drawing 8+ layers, FR4 material (Min=4.0-4.5). Vias are minimal (blind/buried), ground planes are for the return path. Max. the track length is 100 mm, t-stub should be avoided.

Single-Ended (DQ/Address): 40Ω ±10% (36-44Ω).ingle-Ended (DQ/Address): 40Ω ±10% (36-44Ω). Track width: 0.15-0.20 mm (oingle-Ended (DQ/Address): 40Ω ±10% (36-44Ω). Track width: 0.15-0.20 mm (on 10 layer PCB, 0.1 mm dielectric thickness). Formunded (DQ/Address): 40Ω ±10% (36-44Ω). Track width: 0.15-0.20 mm (on 10 layer PCB, 0.1 mm dielectric thicknSingle-Ended DQ/Address: 40Ω ±10 (36-44Ω). Track width: 0.15-0.20 mm (on 10 layer PCB, 0.1 mm dielectric thickness). Formula: Z0= (87/√(er+1.41)) * ln(5.98h /(0.8w+t)), er=Min, h=dielectric thickness, w=width, t=copper thickness (1 oz=35µm). Example: h=0.127 mm, w=0.127 mm → ~45Ω (should be adjusted in simulation, needs to be verified with Sonnet Lite).

Differential (DQS/Clock): 80-100Ω ±10%. Double trace spacing 0.1-0.15 mm.

Calculation Tips: Use Polar SI9000 or online tools. 10% deviation (e.g.alculation Tips: Use Polar SI9000 or online tools. 10% deviation (e.g. 45.5Ω) is tolealculation Tips: Use Polar SI9000 or online tools. 10% deviation (e.g. 45.5Ω) is tolerable at low speed, but at 1066 Mb/s the jitter incrCalculation Tips: Use Polar SI9000 or online tools. 10% deviation (e.g. 45.5Ω) is tolerable at low speed, but at 1066 Mb/s the jitter increases alculation Tips: Use Polar SI9000 or online tools. 10% deviation (e.g. 45.5Ω) is tolerable at low 

Dense BGA requires difficult machine assembly for reballing in production.

Trace widths are narrow (below 0.1 mm), lack of simulation for impedance deviation, simulation tools are difficult to use and require extensive engineering knowledge. I need support in this regard!ense BGA requires difficult machine assembly for reballing in production.

Trace w.